Display apparatus

ABSTRACT

A display apparatus including a plurality of display modules each including a module substrate and a plurality of light emitting devices mounted on the module substrate, and a support substrate on which the display modules are disposed and including conductive members, in which the module substrates includes a plurality of recesses depressed from at least one end surface of the module substrate, and connection electrodes formed in the recesses, and the light emitting devices are electrically connected to the conducive members of the support substrate through the connection electrodes.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefit of U.S. Provisional PatentApplication No. 62/958,879 filed on Jan. 9, 2020, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Exemplary embodiments of the present invention relate generally to adisplay apparatus, and more particularly, to a large-area multi-moduledisplay apparatus.

Discussion of the Background

A display apparatus employing light emitting diodes (LEDs) has beenrecently developed. The display apparatus employing light emittingdiodes may be manufactured by forming structures of individually grownred (R), green (G) and blue (B) light emitting diodes (LEDs) on a finalsubstrate.

However, demands for a display apparatus having various areas,particularly a large area, are increasing, in addition to a highresolution full-color display apparatus.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Exemplary embodiments provide a high quality large-area multi-moduledisplay apparatus and a method of manufacturing the same.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

A display apparatus according to an exemplary embodiment includes aplurality of display modules each including a module substrate and aplurality of light emitting devices mounted on the module substrate, anda support substrate on which the display modules are disposed andincluding conductive members, in which the module substrates includes aplurality of recesses depressed from at least one end surface of themodule substrate, and connection electrodes formed in the recesses, andthe light emitting devices are electrically connected to the conducivemembers of the support substrate through the connection electrodes.

At least one the module substrates may include a plurality ofprotrusions on at least one end surface thereof to correspond to therecesses of an adjacent module substrate.

A depressed portion of each of the recesses may have at least one ofsubstantially a triangular shape, substantially a semi-circular shape,and substantially a semi-elliptical shape in plan view.

Each of the module substrates may include the protrusions on at leastone end surface thereof.

Each of the recesses may be filled with the connection electrode.

The display apparatus may further include a protection material disposedin the recesses, in which the connection electrode may be disposedbetween a surface of the recess and the protection material.

The display apparatus may further include a connection wire disposed onan upper surface of the module substrate and connected to the connectionelectrode, and a back connection wire disposed on a lower surface of themodule substrate and connected to the connection electrode, the backconnection wire being connected to the support substrate via a ball gridarray (BGA) or a conductive bonding member.

The support substrate may include a conductive electrode portiondisposed on a surface thereof facing the module substrate, and theconnection electrode may contact the conductive electrode portionthrough the back connection wire.

The number of connection electrodes may correspond to the number oflight emitting devices so as to drive the light emitting devices.

The module substrate may include a pixel region in which the lightemitting devices are disposed to display an image and a non-pixel regionsurrounding the pixel region, and at least some of the connection wiresmay be disposed in the pixel region.

The recesses may be disposed in the non-pixel region.

The recesses may be disposed along an edge of the module substrate.

A method of manufacturing a display apparatus according to anotherexemplary embodiment includes manufacturing a plurality of displaymodules each including a module substrate, and disposing the displaymodules on a support substrate, in which manufacturing each of thedisplay modules includes forming recesses on at least one end surface ofthe module substrate, forming connection electrodes on the recesses,forming light emitting devices on the module substrate, and forming adrive circuit unit on a lower surface of the module substrate, andelectrically connecting the light emitting devices to the drive circuitunit through the connection electrodes.

The recesses may be formed by laser beams.

Forming the connection electrodes may include forming a conductive layeron the at least one end surface of the module substrate on which therecesses are formed, and grinding the at least one end surface of themodule substrate to remove the conductive layer in area other than therecesses.

The recesses and the connection electrodes on the module substrates maybe formed simultaneously after arranging the module substratesadjacently to each other.

The method may further include forming connection wires and backconnection wires on upper and lower surfaces of the module substrate,respectively.

The method may further include forming protrusions on at least one endsurface of the module substrate.

The protrusions and recesses of adjacent display modules may be engagedwith each other.

The display modules may be disposed on the support substrate by a ballgrid array (BGA).

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1 is a schematic perspective view of a display apparatus accordingto an exemplary embodiment.

FIG. 2 is an enlarged plan view of Part P1 of FIG. 1 .

FIG. 3 is a perspective view conceptually illustrating one corner of adisplay module of a display apparatus according to an exemplaryembodiment.

FIG. 4A and FIG. 4B are cross-sectional views taken along line A-A′ ofFIG. 3 according to exemplary embodiments.

FIG. 5 is a schematic cross-sectional view of a light emitting deviceaccording to an exemplary embodiment.

FIG. 6 is a schematic view illustrating a connection relationship on aback surface of a display apparatus according to an exemplaryembodiment.

FIG. 7A, FIG. 7B, FIG. 7C, and FIG. 7D are plan views illustrating amethod of manufacturing the display apparatus according to an exemplaryembodiment.

FIG. 8 is a schematic perspective view of an assembly of display modulesand a support substrate according to an exemplary embodiment.

FIG. 9 is a schematic perspective view illustrating a process ofsimultaneously forming multiple recesses on multiple module substrates.

FIG. 10 is a plan view of recesses according to exemplary embodiments.

FIG. 11 is a plan view of connection electrodes according to exemplaryembodiments.

FIG. 12A, FIG. 12B, and FIG. 12C are plan views illustrating twoadjacent display modules according to exemplary embodiments.

FIG. 13 is a structural view of a display apparatus according to anexemplary embodiment.

FIG. 14 is an enlarged plan view of Part P1 of FIG. 1 according toanother exemplary embodiment.

FIG. 15A is an enlarged plan view of Part P1 of FIG. 1 according toanother exemplary embodiment, and FIG. 15B is a conceptual view of thelight emitting device shown in FIG. 15A.

FIG. 16A is a plan view of a portion of a display module according to anexemplary embodiment illustrating a securing member between adjacentmodule substrates, and FIG. 16B and FIG. 16C are cross-sectional viewstaken along line B-B′ of FIG. 16A according to exemplary embodiments.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z-axes, and may be interpretedin a broader sense. For example, the D1-axis, the D2-axis, and theD3-axis may be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

Exemplary embodiments relate to a display apparatus including pixels. Inthe display apparatus according to exemplary embodiments, light emittingdevices may be used for pixels that display an image. The displayapparatus includes televisions, tablets, e-book display apparatuses,computer monitors, kiosks, digital cameras, game consoles, mobilephones, PDAs, vehicular displays, and large outdoor/indoor electronicdisplays, without being limited thereto.

A display apparatus according to an exemplary embodiment may includemicro-light emitting devices. The micro-light emitting devices may havea width or length of about 1 micrometer to about 800 micrometers, awidth or length of about 1 micrometer to about 500 micrometers, or awidth or length of about 10 micrometers to about 300 micrometers.However, the inventive concepts are not limited thereto, and in someexemplary embodiments, the micro-light emitting devices may have asmaller or larger size as needed. Hereinafter, the micro-light emittingdevices will also be referred to as “light emitting devices”.

Hereinafter, embodiments of the present disclosure will be described indetail with reference to the accompanying drawings.

FIG. 1 is a schematic perspective view of a display apparatus accordingto an exemplary embodiment. FIG. 2 is an enlarged plan view of Part P1of FIG. 1 .

FIG. 3 is a perspective view of one corner of a display module of adisplay apparatus according to an exemplary embodiment. FIG. 4A and FIG.4B are cross-sectional views taken along line A-A′ of FIG. 3 accordingto exemplary embodiments.

Referring to FIG. 1 to FIG. 3 , FIG. 4A, and FIG. 4B, a displayapparatus 100 according to an exemplary embodiment includes a supportsubstrate 160 and multiple display modules 110 disposed on the supportsubstrate 160. Each of the display modules 110 has a pixel region 111 inwhich an image is displayed, and may be disposed along columns and rowson the support substrate 160. The display module 110 may be formed withat least one pixel, preferably multiple pixels, in the pixel region 111.

The support substrate 160 may be formed with an interconnect portion andlight emitting devices 130, and may be robust or flexible. The supportsubstrate 160 may have a larger area than individual display modules110, such that multiple display modules 110 can be mounted on thesupport substrate 160. According to the illustrated exemplaryembodiment, the display apparatus 100 may have a large display screenthrough combination of multiple display modules 110.

The support substrate 160 may be formed of, for example, glass, quartz,ceramics, Si, SiC, metals, fibers, polymers, and the like, and may be atransparent or opaque substrate. In addition, the support substrate 160may be a robust or flexible printed circuit board (PCB).

In an exemplary embodiment, the support substrate 160 may be atransparent substrate, such as glass, quartz, transparent ceramics, atransparent PCB, and the like. The interconnect portion on the supportsubstrate 160 may be formed of a transparent film, such as a transparentconductive oxide film and the like. When the support substrate 160includes the transparent substrate, the background may be observedthrough the transparent substrate before the display apparatus is turnedon. For example, when the support substrate 160 is attached to a walland the display apparatus turned off, a display screen of the displayapparatus may not be substantially observed while the wall can beobserved through the support substrate 160. Since light emitting devices130 have very small sizes, the background can be observed throughregions between the light emitting devices 130. In this manner, atransparent display apparatus, for example, a head-up display, may beprovided.

Furthermore, when the support substrate 160 is formed of a flexibleplastic material, a flexible display may be provided.

Each of the display modules 110 includes a module substrate 120 andmultiple light emitting devices 130 mounted on an upper surface of themodule substrate 120.

The module substrate 120 of each of the display modules 110 may beformed of various materials. For example, the module substrate 120 maybe formed of a light transmissive insulating material. As used herein,the module substrate 120 having “light transmittance” means not only amodule substrate 120 that is transparent to transmit all fractions oflight therethrough, but also a module substrate 120 that is translucentor partially transparent to transmit light having a certain wavelengthor some fractions of light having a certain wavelength to passtherethrough. The module substrate 120 may include glass, quartz,organic polymer resins, organic/inorganic composites, and the like.However, the inventive concepts are not limited thereto as long as themodule substrate 120 has light transmittance and insulating properties.

The module substrate 120 includes at least one pixel region 111 and anon-pixel region surrounding the pixel region 111. The pixel region 111refers to a region in which a pixel is disposed, and through which lightemitted from the light emitting device 130 travels to be viewed by auser. The non-pixel region refers to a region excluding the pixel region111. The non-pixel region is disposed at one or more sides of the pixelregion 111. In the illustrated exemplary embodiment, the non-pixelregion surrounds the pixel region 111.

The pixel region 111 is provided with at least one light emitting device130. According to the illustrated exemplary embodiment, the pixel region111 is provided with multiple light emitting devices 130.

A pixel unit 113 refers to the smallest unit displaying an image. Eachpixel unit 113 may emit white light and/or light of a certain color.Each pixel unit 113 may include one pixel emitting one color, or mayinclude multiple pixels to emit white light and/or light of a certaincolor through combination of different colors. For example, each of thedisplay modules 110 may include first to third pixels.

The pixels are disposed in the pixel region 111 on the module substrate120. The pixel unit 113 in each of the display modules 110 is providedwith at least one pixel. For example, each of the pixel units 113 mayinclude first to third pixels. The first to third pixels may be realizedby first to third light emitting devices 130 a, 130 b, 130 c. When lightemitted from the first to third pixels is referred to as first to thirdlight, the first to third light may have different wavelength bands. Inan exemplary embodiment, the first to third light may correspond toblue, red, and green wavelength bands, respectively. However, thewavelength bands of light emitted from the pixels included in thedisplay module 110 are not limited thereto, and may correspond to cyan,magenta, and yellow wavelength bands, respectively, in another exemplaryembodiment.

The light emitting devices 130 may be provided to each of the pixels toemit light having various wavelengths. In an exemplary embodiment, thelight emitting devices 130 may include first to third light emittingdevices 130 a, 130 b, 130 c, which emit green, red, and blue light asthe first to third light, respectively. In the illustrated exemplaryembodiment, the first to third light emitting devices 130 a, 130 b, 130c may be realized by a blue light emitting diode, a red light emittingdiode, and a green light emitting diode, respectively. However, inanother exemplary embodiment, the first to third light may have thewavelength bands other than blue, red, and green light to realize a bluecolor, a red color, and a green color. For example, even when the firstto third light has the same wavelength band, a final color of emissionlight may be controlled using a light conversion layer adapted toconvert at least some of the first to third light into light havingdifferent wavelength bands from the first to third light. The lightconversion layer may include materials, such as phosphors and quantumdots, which can convert light having a certain wavelength into lighthaving a different wavelength. As such, in order to realize the first tothird pixels that emit a green color, a red color and/or a blue color,respectively, the light emitting devices 130 may employ other lightemitting diodes that the blue light emitting diode, the red lightemitting diode, and the green light emitting diode. For example, a redlight emitting diode may be used to realize a red color, or a blue or UVlight emitting diode and a light conversion layer adapted to emit redlight through absorption of blue light or UV light may be used togetherto realize a red color.

The light emitting devices 130 are formed in minute sizes, and thus, canbe mounted on a ductile module substrate, such as a plastic substrate,through a transfer process. The light emitting devices 130 according toan exemplary embodiment may be inorganic light emitting devices, whichmay be formed through thin film growth of inorganic materials unlikeorganic light emitting devices. As such, the light emitting devices 130may be manufactured at high yield through a simple process. Further,individual light emitting diodes 130 that has been divided from a mothersubstrate can be simultaneously transferred to a large substrate,thereby facilitating manufacture of a large-area display apparatus.Furthermore, the light emitting devices formed of the inorganicmaterials have advantages over organic light emitting devices, such ashigher brightness, longer lifespan, and lower prices.

Referring to FIG. 3 , the module substrate 120 includes recesses 127formed on a side surface and connection electrodes 123 each disposed inthe recess 127. The recesses 127 are depressed inwards from the sidesurface of the module substrate 120 and forms a groove by removing aportion of the side surface of the module substrate 120 from an uppersurface of the module substrate 120 towards a lower surface thereof. Theconnection electrode 123, more specifically, a side electrode 123 b ofthe connection electrode 123, is disposed on the side surface of themodule substrate 120 and forms the interior of the recess 127.

An upper pad 123 a connected to the side electrode 123 b is provided onthe upper surface of the module substrate 120, and a lower pad 123 cconnected to the side electrode 123 b is provided on the lower surfaceof the module substrate 120. The upper pad 123 a may contact aconnection wire 129 to be connected thereto, or may be integrally formedwith the connection wire 129. The connection wire 129 is electricallyconnected to the light emitting devices 130. The lower pad 123 c maycontact a lower connection wire 159 (see FIG. 6 ) to be connectedthereto, or may be integrally formed therewith, to thereby beelectrically connected to a drive circuit unit or the support substrate.The connection wire 129 and the lower connection wire 159 may include adata line and/or a scan line.

Wires formed on the lower surface of the module substrate 120 may beconnected to a separate drive circuit unit 150. For example, referringto FIG. 4A, the drive circuit unit 150 may be a separate printed circuitboard disposed on the lower surface of the module substrate 120, and beconnected to the wires formed on the lower surface of the modulesubstrate 120. Wires formed on the upper surface of the module substrate120 may be connected to the wires formed on the lower surface of themodule substrate 120 through the connection electrodes 123 disposed onthe recesses 127 described below.

In the illustrated exemplary embodiment, the drive circuit unit 150 ismanufactured as a separate printed circuit board and is disposed on thelower surface of the module substrate 120. However, the inventiveconcepts are not limited thereto. In some exemplary embodiments, thedisplay apparatus may further include a separate additional drivecircuit unit. The separate additional drive circuit unit may be disposedtogether with separate wires on the support substrate 160. For example,referring to FIG. 4B, the wires formed on the lower surface of themodule substrate 120 may be connected to the support substrate 160.

In an exemplary embodiment, the module substrate 120 may also includedrive devices for driving the light emitting devices 130 in addition tothe multiple wires. The drive devices may be thin film transistors, forexample, each of which may be connected to the corresponding lightemitting device 130 to turn on or off the light emitting devices 130 inresponse to a drive signal from the outside.

As the first to third light emitting device 130 a, 130 b, 130 c, varioustypes of light emitting diodes may be employed.

FIG. 5 is a schematic cross-sectional view of the light emitting device130 according to an exemplary embodiment. The light emitting device 130shown in FIG. 5 may be one of the first to third light emitting devices130 a, 130 b, 130 c.

Referring to FIG. 5 , the light emitting device includes a devicesubstrate 131, a first semiconductor layer 132, an active layer 133, asecond semiconductor layer 134, a first contact electrode 135 a, asecond contact electrode 135 b, an insulating layer 136, a first contactpad 137 a, and a second contact pad 137 b.

In an exemplary embodiment, for the light emitting device adapted toemit green light, the first semiconductor layer 132, the active layer133, and the second semiconductor layer 134 may include indium galliumnitride (InGaN), gallium nitride (GaN), aluminum indium gallium nitride(AlInGaN), gallium phosphide (GaP), aluminum gallium indium phosphide(AlGaInP), and aluminum gallium phosphide (AlGaP). In an exemplaryembodiment, for the light emitting device adapted to emit red light, thefirst semiconductor layer 132, the active layer 133, and the secondsemiconductor layer 134 may include aluminum gallium arsenide (AlGaAs),gallium arsenide phosphide (GaAsP), aluminum gallium indium phosphide(AlGaInP), and gallium phosphide (GaP). In an exemplary embodiment, forthe light emitting device adapted to emit blue light, the firstsemiconductor layer 132, the active layer 133, and the secondsemiconductor layer 134 may include gallium nitride (GaN), indiumgallium nitride (InGaN), aluminum indium gallium nitride (AlInGaN), andzinc selenide (ZnSe).

The first and second semiconductor layers 132, 134 may be doped withdifferent types of dopants, respectively, and may be an n-typesemiconductor layer or a p-type semiconductor layer depending upon thetype of dopant. For example, the first semiconductor layer 132 may be ann-type semiconductor layer and the second semiconductor layer 134 may bea p-type semiconductor layer. Alternatively, the first semiconductorlayer 132 may be a p-type semiconductor layer and the secondsemiconductor layer 134 may be an n-type semiconductor layer.

Although each of the first semiconductor layer 132 and the secondsemiconductor layer 134 is exemplarily illustrated as a single layer inthe drawings, in some exemplary embodiments, at least one of the firstsemiconductor layer 132 and the second semiconductor layer 134 may bemultiple layers and may include a super-lattice layer. The active layer133 may have a single quantum well structure or a multi-quantum wellstructure, and the composition of nitride semiconductors for the activelayer 133 may be adjusted to emit light having a desired wavelength.

The first contact electrode 135 a is disposed on the first semiconductorlayer 132, on which the active layer 133 and the second semiconductorlayer 134 are not disposed, and the second contact electrode 135 b isdisposed on the second semiconductor layer 134.

The first contact electrode 135 a and/or the second contact electrode135 b may be formed as a single metallic layer or multiple metalliclayers. The first contact electrode 135 a and/or the second contactelectrode 135 b may be formed of various metals, such as Al, Ti, Cr, Ni,Au, Ag, Cu, and the like, and an alloy thereof.

The insulating layer 136 is formed on the first and second contactelectrodes 135 a, 135 b, and the first and second contact pads 137 a,137 b are disposed on the insulating layer 136 to be connected to thefirst contact electrode 135 a and the second contact electrode 135 bthrough contact holes, respectively. In the illustrated exemplaryembodiment, the first contact pad 137 a is connected to the firstcontact electrode 135 a and the second contact pad 137 b is connected tothe second contact electrode 135 b. However, the inventive concepts arenot limited thereto. For example, in another exemplary embodiment, thesecond contact pad 137 b may be connected to the first contact electrode135 a and the first contact pad 137 a may be connected to the secondcontact electrode 135 b.

The first contact pad 137 a and/or the second contact pad 137 b may beformed as a single layer or multiple layers. The first contact pad 137 aand/or the second contact pad 137 b may be formed of various metals,such as Al, Ti, Cr, Ni, Au, and the like, or an alloy thereof.

The light emitting device 130 may further include additional functionallayers in addition to the aforementioned layers. For example, in someexemplary embodiments, the light emitting device 130 may further includea reflective layer for reflection of light, an additional insulatinglayer for insulation of a specific component, an anti-solder layer forpreventing diffusion of solders, and the like.

Although the light emitting device 130 shown in FIG. 5 is exemplaryillustrated as including the first and second contact pads 137 a and 137b facing in an upward direction, in another exemplary embodiment, thelight emitting device 130 may be mounted on the module substrate 120after being flipped upside down such that the first and second contactpads 137 a and 137 b face the upper surface of the module substrate 120.The first and second contact pads 137 a and 137 b may be directlyelectrically connected to the interconnect portion on the modulesubstrate 120, or may be electrically connected thereto through aconductive bonding member.

Referring back to FIG. 1 to FIG. 3 , FIG. 4A and FIG. 4B, in the displayapparatus 100 according to an exemplary embodiment, the light emittingdevices 130 are turned on to emit light upon application of a commonvoltage and data signals thereto. In this manner, light emitted from thelight emitting devices 130 travels towards the lower surface of themodule substrate 120 through the module substrate 120 disposed under thelight emitting devices 130.

In an exemplary embodiment, each of the display modules 110 is connectedto an interconnect portion formed on the upper surface of the supportsubstrate 160, particularly to a conductive electrode portion 163.Various kinds of interconnects and circuits (for example, variouscircuits for driving the pixels in addition to an additional drivecircuit unit) may be formed on the support substrate 160, and drivesignals may be provided to the light emitting devices 130 disposed inthe display modules 110 through the conductive electrode portion 163. Tothis end, the module substrate 120 of the display module 110 is providedwith a structure for connecting the conductive electrode portion 163 ofthe support substrate 160 to the interconnect portion 129 on the uppersurface of the module substrate 120.

Each of the display modules 110 has a connection structure forconnecting the light emitting devices 130 disposed on the upper surfaceof the module substrate 120 to the drive circuit unit 150 disposed underthe module substrate 120, or to the support substrate 160.

Referring back to FIG. 3 , at least one end surface of each of themodule substrates 120 may include the recesses 127 depressed from theend surface of the module substrate 120. The recesses 127 may bedisposed in the non-pixel region, rather than in the pixel region 111,and thus, may be arranged along an edge of the module substrate 120. Thenumber of recesses 127 formed in the module substrate 120 is notparticularly limited, but may be set to correspond to the number oflight emitting devices 130 to allow connection of the connection wires129 to the light emitting devices 130.

Each of the recesses 127 is formed by cutting a portion of the sidesurface of the module substrate 120 from the upper surface of the modulesubstrate 120 to the lower surface thereof. Each of the recesses 127 isprovided with the connection electrode 123. Each of the connectionelectrodes 123 includes the upper pad 123 a formed on the upper surfaceof the module substrate 120, the lower pad 123 c formed on the lowersurface of the module substrate 120, and the side electrode 123 bcorresponding to the interior of the recess 127 and connecting the upperpad 123 a to the lower pad 123 c. The upper pad 123 a may be connectedto the connection wire 129 formed on the upper surface of the modulesubstrate 120, and the lower pad 123 c may be connected to the lowerconnection wire 159 formed on the lower surface of the module substrate120, or to the conductive electrode portion 163 of the support substrate160.

When the drive circuit unit 150 is separately formed on the lowersurface of the module substrate 120 to drive the light emitting devices130 according to the illustrated exemplary embodiment, the lower pad 123c is connected to the drive circuit unit 150 through the connection wire129 disposed on the lower surface of the module substrate 120.

FIG. 6 is a schematic view illustrating a connection relationship on aback surface of the display apparatus 100 according to an exemplaryembodiment, in which the separate drive circuit unit 150 is disposed onthe lower surface of the module substrate 120.

Referring to FIG. 1 to FIG. 6 , the drive circuit unit 150 may beprovided singularly or in plural as shown in the drawings. For example,the drive circuit unit 150 may include a first drive circuit unit 151and a second drive circuit unit 153. The first and second drive circuitunits 151, 153 are electrically connected to the lower pads 123 c of theconnection electrodes 123 through the lower connection wires 159 formedon the lower surface of the module substrate 120. The first drivecircuit unit 151 and the second drive circuit unit 153 may be, forexample, a scan driver and a data driver, respectively. The first drivecircuit unit 151 and the second drive circuit unit 153 may be disposedin regions corresponding to the pixel region 111 and/or the non-pixelregion.

When the drive circuit unit 150 is not separately disposed on the lowersurface of the module substrate 120, or when the drive circuit unit 150needs to be connected to an additional device, the lower pad 123 c isconnected to the conductive electrode portion 163 on the supportsubstrate 160. The lower pad 123 c may be connected to the conductiveelectrode portion 163 of the support substrate 160 through a conductivebonding member 140, such as solder pastes, disposed between the lowerpad 123 c and the conductive electrode portion 163. Alternatively, thelower pad 123 c may be connected to the conductive electrode portion 163of the support substrate 160 by a ball grid array. In this case, solderballs may be disposed between the lower pad 123 c and the conductiveelectrode portion 163 of the support substrate 160.

The support substrate 160 may be provided with various devices, forexample, a timing controller, a memory including an EEPROM, circuits fordriving the light emitting device 130 such as a voltage source and thelike, and the interconnect portion including various wires electricallyconnected to the conductive electrode portion 163. The support substrate160 may be formed with a gate driver and a data driver, which supplyscan signals and image signals to a scan line and a data line,respectively.

Drive signals output from the drive circuit unit 150 or from variousdevices of the support substrate 160 are sent to the light emittingdevices 130 through the connection electrodes 123 such that the lightemitting devices 130 can be turned on or off to display an image.

As such, the display apparatus 100 according to an exemplary embodimentmay be provided as a multi-module display apparatus including multipledisplay modules 110. For example, FIG. 1 exemplarily shows the displayapparatus 100 including 4×5 display modules 110.

In the illustrated exemplary embodiment, each or at least some of themultiple display modules 110 may be independently driven, or at leastsome of the multiple display modules 110 may be dependently driven inassociation with the multiple other display modules 110. A single imagemay be displayed by driving the multiple display modules 110 inassociation with one another.

Although each of the multiple display modules 110 is exemplarilyillustrated as having the same size, the inventive concepts are notlimited thereto. In some exemplary embodiments, at least one displaymodule may have a different size from the remaining display modules.Further, in some exemplary embodiments, at least one display module mayinclude a different number of pixels from the remaining display modules,and thus, may have different resolution from the remaining displaymodules. Furthermore, when all regions of the display apparatus 100 doesnot require the same resolution, the display apparatus 100 may bemanufactured by arranging display modules having different resolutions.

In an exemplary embodiment, each of the display modules 110 may have ashape other than a rectangular shape. In particular, depending on theoverall shape of the display apparatus 100, the display modules 110 mayhave a shape other than a rectangular shape. In addition, the number ofsupport substrates 160 or the number of display modules 110 mounted onthe support substrate 160 may be changed in various ways according tothe size of the display apparatus 100 to be manufactured.

With this structure, the display apparatus 100 can minimize imagedivision or generation of dark lines on an image displayed on a screenof the display apparatus 100 by minimizing separation of the pixelregion between adjacent display modules 110 during manufacture of alarge-area multi-module display apparatus. According to an exemplaryembodiment, the connection electrodes 123 may be formed on the side ofthe module substrate 120 on which the light emitting devices 130 aremounted, particularly in the non-pixel region directly adjacent to thepixel region. In this case, a portion formed with the connectionelectrode 123 corresponds to a portion inwardly depressed from one endsurface of the module substrate 120, thereby obviating the need for anadditional interconnect structure outside the module substrate 120.Accordingly, the display apparatus 100 according to an exemplaryembodiment may obviate a separate device on the side surface of themodule substrate 120 for connecting the display module 110 to thesupport substrate 160, such that a distance between two adjacent displaymodules 110 can be minimized because a space for mounting the separatedevice on the side surface of the module substrate 120 may not benecessary.

FIG. 7A to FIG. 7D are plan views illustrating a method of manufacturingthe display apparatus according to an exemplary embodiment.

Referring to FIG. 7A to FIG. 7D, the display apparatus 100 according anexemplary embodiment may be manufactured by manufacturing multipledisplay modules 110 and placing the multiple display modules 110 on asupport substrate 160.

First, the step of manufacturing the multiple display modules 110 willbe described.

Referring to FIG. 7A, module substrates 120 are prepared. The modulesubstrates 120 may be formed of a light transmitting insulatingmaterial.

Recesses 127 may be formed on at least one end surface of each of themodule substrate 120, which may be formed by removing a portion of aside surface of the module substrate 120. The recesses 127 may be formedby partially cutting the side surface of the module substrate 120 usinglaser beams or a tool, such as a sawtooth and the like. However, theinventive concepts are not limited to a particular method of forming therecesses 127.

Referring to FIG. 7B, a conductive layer CDT is formed on the sidesurface of the module substrate 120. The conductive layer CDT may beformed substantially on the entirety of the side surface of the modulesubstrate 120, on which the recesses 127 are formed. The conductivelayer CDT may be formed by plating. However, the inventive concepts arenot limited thereto, so long as the conductive layer CDT can be formedon the side surface of the module substrate 120.

Referring to FIG. 7C, a grinding process may be performed on the atleast one end surface of the module substrate 120. By grinding, theconductive layer CDT is removed from the end surface of the modulesubstrate 120 other than that in the recesses 127, such that theconductive layer CDT formed in the recesses 127 is retained to functionas connection electrodes, particularly side connection electrodes 123.

Referring to FIG. 7D, a protection material BM may be formed in therecesses 127 in which the connection electrodes 123 are formed. Theprotection material BM may be optionally formed in the recesses 127.Alternatively, assembly of the display modules 110 may be performedwithout forming the protection material BM. The protection material BMmay be formed of a black insulating material capable of absorbing light.

Next, light emitting devices 130 are formed on each of the modulesubstrates 120. Before forming the light emitting devices 130,additional connection wires and/or back connection wires may be formedon upper and lower surfaces of the module substrate 120.

A drive circuit unit is prepared and disposed on the lower surface ofeach of the module substrates 120, and is electrically connected to thelight emitting devices 130 through the connection electrodes 123,thereby providing the display modules 110.

FIG. 8 is a schematic perspective view of an assembly of display modulesand a support substrate.

Referring to FIG. 8 , the display modules 110 formed through theaforementioned processes are disposed on the support substrate 160, andare electrically connected to each other. The multiple modules 110 maybe disposed along columns and rows on the support substrate 160. Aconductive bonding agent, such as solder pastes, or solder balls for aball grid array, may be disposed between the display modules 110 and thesupport substrate 160 to electrically connect the display modules 110 tothe support substrate 160.

As described above, each of the display modules 110 is manufactured bysimply forming the recesses 127 on the module substrate 120 and theconnection electrodes 123 in the recesses 127, followed by attaching thedisplay modules 110 to the support substrate 160 through soldering or aball grid array, thereby facilitating manufacture of a multi-moduledisplay apparatus through an inexpensive and simple process.

The display apparatus according to exemplary embodiments may bemanufactured by various methods.

The recesses 127 may be individually formed on a single module substrate120, or may be simultaneously formed on multiple module substrates 120.

FIG. 9 is a schematic perspective view illustrating a process ofsimultaneously forming multiple recesses on multiple module substratesaccording to an exemplary embodiment. FIG. 9 exemplarily illustrates twomodule substrates.

Referring to FIG. 9 , multiple module substrates 120 a, 120 b arearranged such that end surfaces of the module substrates 120 a, 120 b tobe formed with the recesses 127 are placed at the same side. In thiscase, an adhesive sheet 170 may be optionally disposed between twoadjacent module substrates 120 a, 120 b to prevent movement of themodule substrates 120 a, 120 b. Next, with the multiple modulesubstrates 120 a, 120 b securely arranged next to each other, therecesses 127 may be formed on the end surfaces of the module substrates120 a, 120 b by cutting the multiple module substrates 120 a, 120 busing laser beams or a tool, such as a sawtooth and the like. The modulesubstrates 120 a, 120 b formed with the recesses 127 may be separatedfrom each other by removing the adhesive sheet 170.

In this manner, the recesses 127 can be easily formed on the multiplemodule substrates 120 a and 120 b.

The recess 127 may be formed in various shapes according to exemplaryembodiments.

FIG. 10 is a plan view of recesses according to exemplary embodiment.

Referring to FIG. 10 , the recesses 127 have at least one ofsubstantially a triangular shape, substantially a semi-circular shape,and substantially a semi-elliptical shape in plan view. The shape of therecesses 127 is not limited thereto and may be modified into variousshapes so long as the recesses 127 are formed in a shape inwardlydepressed from one end surface of the module substrate 120. Further, inone module substrate 120, all of the recesses 127 may have the sameshape, for example, a triangular shape, without being limited thereto.Alternatively, the recesses 127 having various shapes may be provided toone module substrate 120 and arranged thereon in various ways.Furthermore, the recesses 127 may be arranged at the same interval.However, the inventive concept are not limited thereto, and the distancebetween the recesses 127 may be variously adjusted as desired.

In some exemplary embodiments, the connection electrodes may be formedin various shapes.

FIG. 11 is a plan view of connection electrodes according to exemplaryembodiments.

Referring to FIG. 11 , each of the connection electrodes 123 may beformed to completely fill the recess 127. The connection electrode 123described above is illustrated as a film conforming to the shape of therecesses 127 with a predetermined thickness. However, the inventiveconcepts are not limited thereto. As shown in FIG. 11 , each of theconnection electrodes 123 may completely fill the entirety of adepressed region of the recess 127 along the side surface of the modulesubstrate 120. In the illustrated exemplary embodiment, the connectionelectrodes 123 may be formed in substantially the same shape as therecesses 127 in plan view.

In an exemplary embodiment, one end surface of the display module 110may be modified in various shapes to facilitate formation of theconnection electrodes 123 or connection of the wires thereon andassembly to the support substrate 160.

FIG. 12A to FIG. 12C are plan views illustrating two adjacent displaymodules according to exemplary embodiments.

When two adjacent module substrates among the module substrates on thesupport substrate 160 are referred to as first and second modulesubstrates 120 a, 120 b, respectively, at least one of the first andsecond module substrates 120 a, 120 b may have multiple recesses formedon at least one end surface thereof, and the other one of the first andsecond module substrates 120 a, 120 b may have multiple protrusionsformed on at least one end surface thereto to correspond to the multiplerecesses.

For example, referring to FIG. 12A, when the first and second modulesubstrates 120 a, 120 b are disposed at the left and right sides,respectively, the second module substrate 120 b at the right side mayhave recesses 127, each of which is inwardly depressed and formed with aconnection electrode 123. The first module substrate 120 a at the leftside may have protrusions 127 p protruding towards the second modulesubstrate 120 b. The protrusions 127 p of the first module substrate 120a may be formed at locations corresponding to the recesses 127 of thesecond module substrate 120 b and may have a size corresponding to thesize of the recesses 127. Accordingly, when the first module substrate120 a is assembled to the second module substrate 120 b, the firstmodule substrate 120 a and the second module substrate 120 b may bearranged such that an edge of the first module substrate 120 a engageswith the corresponding edge of the second module substrate 120 b.

In an exemplary embodiment, the recesses and the protrusions may bedisposed on the first and second module substrates in various ways.

For example, referring to FIG. 12B, the first module substrate 120 a mayhave both protrusions 127 pa and recesses 127 a formed on one endsurface thereof. The recesses 127 a may be depressed in an inwarddirection of the first module substrate 120 a and connection electrodes123 a may be disposed in the recesses 127 a, respectively. Theprotrusions 127 pa may protrude towards the second module substrate 120b. The second module substrate 120 b may have the protrusions 127 pb ina region corresponding to the recesses 127 a of the first modulesubstrate 120 a, and recesses 127 b in a region corresponding to theprotrusions 127 pa of the first module substrate 120 a. The connectionelectrodes 123 a, 123 b may be disposed in the recesses 127 a, 127 b ofthe first and second module substrate 120 a and 120 b, respectively. Assuch, each of the first and second module substrates 120 a, 120 b mayhave the recesses 127 a, 127 b and the protrusions 127 pa, 127 pb on atleast one end surface thereof.

Referring to FIG. 12C, the recesses 127 a of the first module substrate120 a may be disposed to alternate with the recesses 127 b of the secondmodule substrate 120 b, rather than being disposed correspondingthereto.

In this manner, the display apparatus may be driven in various ways. Forexample, the pixels may be driven in a passive manner or in an activemanner.

FIG. 13 is a structural view of a display apparatus according to anexemplary embodiment.

Referring to FIG. 13 , the display apparatus according to an exemplaryembodiment includes a timing controller 155, a first driver 151, asecond driver 153, an interconnect portion, and pixels realized by thefirst to third light emitting devices 130 a, 130 b, 130 c. In theillustrated exemplary embodiment, the first driver 151 and the seconddriver 153 may be a scan driver and a data driver, respectively.Hereinafter, the first driver 151 and the second driver 153 may bereferred to as the scan driver and the data driver, respectively.

Each of the pixels is individually connected to the scan driver 151 andthe data driver 153 through the interconnect portion.

The timing controller 155 receives image data and various controlsignals for driving the display apparatus from the outside, such as froma system transmitting the image data. Then, the timing controller 155sends the image data to the data driver 153 after rearrangement of thereceived image data. In addition, the timing controller 155 generatesscan control signals and data control signals for driving the scandriver 151 and the data driver 153, and sends the scan control signalsand the data control signals to the scan driver 151 and the data driver153, respectively.

The scan driver 151 receives the scan control signals sent from thetiming controller 155, and generates scan signals corresponding thereto.

The data driver 153 receives the data control signals and the image datasent from the timing controller 155, and generates data signalscorresponding thereto.

The interconnect portion includes multiple signal wires. Moreparticularly, the interconnect portion includes first wires 103, whichconnect the scan driver 151 to the pixels, and second wires 102, whichconnect the data driver 153 to the pixels. In the illustrated exemplaryembodiment, the first wires 103 may be scan lines and the second wires102 may be data lines. The interconnect portion may further includewires that connect the timing controller 155 to the scan driver 151, thedata driver 153, and other components.

The scan signals generated by the scan driver 151 are sent to the pixelsthrough the scan lines 103. The data signals generated by the datadriver 153 are sent to the data lines 102. The data signals sent to thedata lines 102 are input to the pixels, in particular, to lines of thedisplay module 110 selected by the scan signals.

The pixels are connected to the scan lines 103 and the data lines 102.The pixels selectively emit light in response to the data signals inputthrough the data lines 102 when the scan signals are supplied from thescan lines 103 to the pixels. For example, in each frame period, each ofthe pixels emits light at brightness corresponding to the data signalinput thereto. In response to data signals corresponding to blackbrightness, the pixels do not emit light to display a black mode for thecorresponding frame period.

In an exemplary embodiment, the light emitting devices may be arrangedin various shapes in the pixel region to form a pixel unit.

FIG. 14 is an enlarged plan view of Part P1 of FIG. 1 according toanother exemplary embodiment. The Part P1 is substantially the same asthat shown in FIG. 2 , except that the light emitting devices aredisposed in a different arrangement.

Referring to FIG. 14 , the pixel region 111 of the module substrate 120may be provided with the multiple light emitting devices 130. Themultiple light emitting devices 130 may be arranged in various shapes toform a pixel unit. Referring back to FIG. 2 , one pixel unit is formedby the first to third light emitting devices 130 a, 130 b, 130 c, whichare arranged in a triangular shape. According to the illustratedexemplary embodiment, the multiple light emitting devices 130 may bearranged in a matrix, as shown in FIG. 14 . For example, when the pixelunit includes the first to third light emitting devices 130 a, 130 b,130 c, the first to third light emitting devices 130 a, 130 b, 130 c maybe alternately arranged along columns or rows, or along both columns androws. As another example, when the pixel unit includes the first tothird light emitting devices 130 a, 130 b, 130 c, the first lightemitting devices 130 a, the second light emitting devices 130 b, and thethird light emitting devices 130 c may be sequentially repeated alongcolumns or rows, or along both columns and rows.

FIG. 15A is an enlarged plan view of Part P1 of FIG. 1 according toanother exemplary embodiment. The Part P1 is substantially the same asthat shown in FIG. 2 , except that the light emitting devices aredisposed in a further different arrangement. FIG. 15B is a conceptualview of the light emitting device shown in FIG. 15A.

Referring to FIG. 15A, the pixel region 111 of the module substrate 120is provided with multiple light emitting devices 230, each of whichforms a pixel unit. Each of the light emitting devices 230 may includemultiple epitaxial stacks that emit light of different colors. Forexample, each of the light emitting devices 230 may include first tothird epitaxial stacks 231, 233, 235 sequentially stacked one aboveanother, as shown in FIG. 15B.

Each of the epitaxial stacks may emit light of a certain color in thevisible spectrum. The first epitaxial stack 231 may emit light of afirst color, the second epitaxial stack 233 may emit light of a secondcolor, and the third epitaxial stack 235 may emit light of a thirdcolor. The first to third colors are different colors from one anotherand may have sequentially decreasing wavelengths in different wavelengthbands. In particular, the first to third colors may have different shortwavelength bands that have gradually increasing energy from the firstcolor to the third color. In the illustrated exemplary embodiment, thefirst color may be red, the second color may be green, and the thirdcolor may be blue. However, the sequence of the first to third colors isnot limited thereto, and may be changed depending upon the laminationsequence of the first to third epitaxial stacks 231, 233, 235 in otherexemplary embodiments.

As such, since one pixel unit formed through lamination can be formed bymounting only one light emitting stack, rather than using the multiplelight emitting devices, more pixel units may be formed in a unit areaand the manufacturing method can be significantly simplified.

The display module according to an exemplary embodiment may be providedwith an additional component for improving assembly of adjacent modulesubstrates.

FIG. 16A is a plan view of a portion of a display module according to anexemplary embodiment, illustrating a securing member between adjacentmodule substrates. FIG. 16B and FIG. 16C are cross-sectional views takenalong line B-B′ of FIG. 16A according to exemplary embodiments.

Referring to FIG. 16A to FIG. 16C, in the display module according to anexemplary embodiment, at least part of corners of each of the modulesubstrates 120 may be chamfered in various shapes. For example, at leastone of four adjacent module substrates 120 may be chamfered in atriangular shape, in a quadrant shape, or in various shapes, in planview. In an exemplary embodiment, each of four corners of the modulesubstrates 120 facing each other is chamfered in a right-angledtriangular shape in plan view.

Since a chamfered portion is removed from the module substrate 120, anempty space is formed in the chamfered portion of the module substrate120. The empty space of the module substrate 120 may be provided with asecuring member 180 to firmly fasten adjacent module substrates 120 toeach other. The securing member 180 may have various shapes to securethe module substrates 120 to each other, and may have a black color toprevent reflection or interference of light emitted from each of thelight emitting devices 130.

In an exemplary embodiment, the securing member 180 may havesubstantially a screw shape. When the securing member 180 hassubstantially the screw shape, the securing member 180 may have threads181 on an outer surface thereof so as to be inserted into the space ofthe module substrate 120 and fastened thereto. In this case, thechamfered portion of the module substrate 120 may be formed with threadscorresponding to the threads 181 of the securing member 180, and themodule substrate 120 may be fastened to the securing member 180 throughthe threads thereof.

In another exemplary embodiment, the module substrate 120 may beprovided with a securing member 180′, which may be provided in the formof a resilient hook pin. In the illustrated exemplary embodiment, thesecuring member 180′ may have a latch hook 183, which secures thesecuring member 180′ from the module substrate 120 when inserted intothe space of the module substrate 120.

As described above, the securing members are provided in the shapes ofthe screw or the hook pin. However, the inventive concepts are notlimited to a particular shape of the securing member, so long as thesecuring member can be inserted into the chamfered portion of the modulesubstrate to secure the module substrates.

Embodiments of the present disclosure provide a large-area displayapparatus that minimizes division of an image or generation of a darkline on the image.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theappended claims and various obvious modifications and equivalentarrangements as would be apparent to a person of ordinary skill in theart.

What is claimed is:
 1. A display apparatus comprising: a plurality ofdisplay modules each including a module substrate and a plurality oflight emitting devices mounted on the module substrate; and a supportsubstrate on which the display modules are disposed and includingconductive members, wherein: the module substrate includes a pluralityof recesses depressed from at least one end surface of the modulesubstrate, and connection electrodes formed in the recesses; the modulesubstrate further includes a protection insulative material disposed inthe recesses, such that the connection electrode is disposed between asurface of the recess and the protection insulative material; at least aportion of the protection insulative material is exposed to the outside;and each of the light emitting devices is electrically connected to oneof the conductive members through at least one of the connectionelectrodes.
 2. The display apparatus according to claim 1, wherein atleast one of the module substrates includes a plurality of protrusionson at least one end surface thereof to correspond to the recesses of anadjacent module substrate.
 3. The display apparatus according to claim2, wherein a depressed portion of each of the recesses has at least oneof substantially a triangular shape, substantially a semi-circularshape, and substantially a semi-elliptical shape in plan view.
 4. Thedisplay apparatus according to claim 2, wherein each of the modulesubstrates includes the protrusions on at least one end surface thereof.5. The display apparatus according to claim 1, wherein each of therecesses is filled with the connection electrode.
 6. The displayapparatus according to claim 1, further comprising: a connection wiredisposed on an upper surface of the module substrate and connected tothe connection electrode; and a back connection wire disposed on a lowersurface of the module substrate and connected to the connectionelectrode, the back connection wire being connected to the supportsubstrate via a ball grid array (BGA) or a conductive bonding member. 7.The display apparatus according to claim 6, wherein the supportsubstrate includes a conductive electrode portion disposed on a surfacethereof facing the module substrate, and the connection electrodecontacts the conductive electrode portion through the back connectionwire.
 8. The display apparatus according to claim 1, wherein the numberof connection electrodes formed in one module substrate is n times thenumber of light emitting devices mounted in the one module substrate, nbeing a positive integer.
 9. The display apparatus according to claim 1,wherein the module substrate comprises a pixel region in which the lightemitting devices are disposed to display an image and a non-pixel regionsurrounding the pixel region, and at least some of the connectionelectrodes are disposed in the pixel region.
 10. The display apparatusaccording to claim 9, wherein the recesses are disposed in the non-pixelregion.
 11. The display apparatus according to claim 1, wherein therecesses are disposed along an edge of the module substrate.